Muffle Furnace Parameter Settings

‌I. Core Parameter Configuration‌

1. ‌Temperature Settings‌

• ‌Target Temperature (SV)‌: Set according to material requirements (e.g., 1000–1300°C for ashing, 1400–1700°C for sintering).‌

• Control Accuracy‌: PID algorithms ensure ±0.5°C precision in advanced models.

• ‌Uniformity‌: Dependent on chamber size and heating element distribution (e.g., three-sided embedded elements for improved gradient).

2. ‌Heating Rate‌

• Standard rate: 5–20°C/min; high-performance models support programmable rates (e.g., 50°C/min with silicon carbide elements).

• Material compatibility: Adjust rates for brittle materials (5–10°C/min recommended)

3. ‌Dwell Time‌

• Set via "ST" (soak time) parameter; for example, 120 mins for complete organic decomposition.

• Programmable controllers allow multi-step timing (e.g., 8-step profiles with hold functions).

4. ‌Atmosphere Control‌

• ‌Ambient mode‌: Default air environment for oxidation.

• ‌Inert gas‌: Use rear gas ports (0.95 cm diameter) for N₂/Ar supply to prevent oxidation.

‌II. Control Panel Functions (English Terms)‌

‌III. Operational Guidelines‌

1. ‌Preheating‌

• Initial current: 25–30 A; preheat to 300°C for 2 hrs to protect heating elements.

2. ‌Cooling‌

• Natural cooling to <200°C before opening the chamber to avoid thermal shock.

3. ‌Safety Features‌

• Overheat protection: Adjustable limit to prevent exceeding 1600°C (element max).

• Door safety switch: Cuts power when opened.

‌IV. Model Selection‌

‌Key Terminology‌

• ‌PLC‌: Programmable Logic Controller (manages heating logic)
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• ‌Thermocouple‌: K-type sensors for temperature monitoring.

• ‌Moldatherm‌: Ceramic fiber insulation for rapid heat-up

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